U-MAP
U-MAP is a hardware company in Nagoya, Japan, founded in 2016. It has raised $5.0M across 2 rounds, most recently a $5.0M Series B in June 2023.
Solving the world's thermal problems with new materials
- Headquarters
- Nagoya
- Employees
- 1–10
- Founded
- 2016
- Business Model
- B2B
- Website
- umap-corp.com
- Total Funding
- $5.0M
- Last Round
- $5.0M Series BJun 2023
- Rounds
- 2
Totals include recorded grants and other qualifying funding, not just equity. What counts toward funding.
Indexed holds 2 funding rounds and 3 investors for this company. The full record is or through the API.
About
U-MAP Co., Ltd. is a deep-tech materials startup founded on December 12, 2016, and headquartered in Nagoya, Japan. The company originated as a spin-out from the world-renowned Ujihara Laboratory at Nagoya University, and is dedicated to developing innovative heat dissipating materials to solve persistent thermal management challenges in electronic devices. U-MAP's flagship product, Thermalnite, is a high-efficiency thermal conductivity material that addresses heat generation problems across industries including smartphones, PCs, electric vehicles, data centers, and 5G infrastructure — areas where conventional industrial materials fall short. The company is led by CEO Kenji Nishitani, COO Takahiro Maeda, and CTO Toru Ujihara (the original lab director at Nagoya University). U-MAP raised $5 million in 2022 to begin mass production and sales of Thermalnite, targeting annual production of one ton by 2024 and full-scale mass production by 2025. The company now offers comprehensive support across all stages of customer engagement, from initial feasibility testing and material characterization to full-scale co-development and mass production, serving electronics manufacturers and other industrial partners globally.
Summary
It lists 1–10 employees. It has raised $5.0M in total across 2 rounds, most recently a $5.0M Series B round in Jun 2023. Investors include Real Tech Holdings, Kyoto University Innovation Capital and Global Brain.
Tech & App Stack
3 technologies & apps tracked
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Funding History
Jun 2023
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Funding: Seed through Series B. Amounts, valuations, and investors where available.
Investors
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