Crystal Sonic

Crystal Sonic is an award-winning deep-tech startup pioneering Sonic Lift-off technology, which uses sound waves to gently separate thin devices from their semiconductor wafer base, enabling wafer reuse. The patented process produces no waste, leaves a smooth and precise surface, and serves as a superior alternative to traditional grinding methods. Crystal Sonic's technology reduces manufacturing cost and waste for next-generation semiconductor materials including SiC, GaN, GaAs, AlN, and LiNbO3 — materials critical to advanced data centers, photonics, wireless communications, and quantum computing. The company has received support from DOE, NASA, and NSF, and won first prize at the 2024 Lam Capital Venture Competition and the inaugural NSTC Symposium pitch competition.