ESWIN Material
IPOPublic · Xi'an, China · $576.0M raised
- Last Round
- $576.0M Series CJan 2023
- Rounds
- 1
- Type
- Public
About
Xi'an-based subsidiary of Beijing ESWIN Technology Group providing silicon materials and semiconductor solutions.
Summary
ESWIN Material is a Semiconductors company based in Xi'an, China. It has raised $576.0M in total across 1 round, most recently a $576.0M Series C round in Jan 2023. Investors include CNBM New Materials Fund and Source Code Capital.
Tech & App Stack
3 technologies & apps tracked
Create a free account — 10 credits a month to unlock the full tech & app stack, funding history, and valuations.
Sign up to view the funding chart
Create a free account — you'll get 10 credits a month to unlock funding history, valuations, and tech stacks.
Funding History
Oct 2025
Sign up to see all 2 rounds
Full funding history, per-round amounts, and investor participation.
Investors
Similar Companies
Japanese semiconductor manufacturer developing advanced 2nm chip technology.
Global FPGA semiconductor company providing programmable logic solutions for cloud, networking, a...
Wheaton Precious Metals is the world's premier precious metals streaming company, owning the righ...
Groq delivers fast, low cost AI inference using custom LPU (Language Processing Unit) chips and G...

AI hardware company building wafer-scale processors for deep learning training and inference
Designs and manufactures precision power conversion, measurement, and control solutions for semic...