ESWIN Material

IPO

Beijing ESWIN Technology Group Co., Ltd.

Public · Xi'an, China · $576.0M raised

Headquarters
Xi'an
Business Model
B2B
Website
eswin.com
Total Funding
$576.0M
Last Round
$576.0M Series CJan 2023
Rounds
1
Type
Public

Totals include recorded grants and other qualifying funding, not just equity. What counts toward funding.

About

Xi'an-based subsidiary of Beijing ESWIN Technology Group providing silicon materials and semiconductor solutions.

Summary

ESWIN Material is a Semiconductors company based in Xi'an, China. It has raised $576.0M in total across 1 round, most recently a $576.0M Series C round in Jan 2023. Investors include CNBM New Materials Fund and Source Code Capital.

Tech & App Stack

3 technologies & apps tracked

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Funding & Exit History

IPOOct 2025
$640.0M

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Funding: Series C. Amounts, valuations, and investors where available.

Investors

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