Thinktrans

Thinktrans Semiconductor Technology Ltd. is a Chinese advanced packaging substrate manufacturer headquartered in Wuhan, Hubei Province, established in 2021 through the restructuring of Thinktrans Optics Valley and Thinktrans Zhuhai. The company specializes in producing IC substrates for semiconductor packaging, including FC-BGA substrates for CPUs, GPUs, MCUs, and ASIC chips, FC-CSP substrates for high-end mobile processors, and flexible printed circuit boards for the mobile phone and tablet industries. Thinktrans also develops glass core substrates for advanced chiplet and next-generation AI chip packaging applications, serving customers in the global semiconductor supply chain.