Lendela

Borrowing Made Better

Singapore, Singapore · Founded 2018 · $5.9M raised

Headquarters
Singapore
Employees
11–50
Founded
2018
Business Model
Marketplace
Total Funding
$5.9M
Last Round
$5.0M Series ASep 2018
Rounds
2

About

Lendela is a Singapore-based fintech platform founded in 2018 on a mission to make access to credit fair and transparent. The company operates a reverse-auction loan matching model in which over 70 banks and licensed loan providers compete to offer borrowers personalised loan options, eliminating the need for repeat applications. Serving more than 300,000 customers across Singapore and Hong Kong, Lendela applies without impacting credit scores and provides dedicated support throughout the borrowing journey. In 2023, the company raised an oversubscribed US$5 million Series A round to scale its model across Asia Pacific.

Summary

Lendela is a Fintech company based in Singapore, Singapore, founded in 2018. It has raised $5.9M in total across 2 rounds, most recently a $5.0M Series A round in Sep 2018. Investors include Cocoon Capital and IMO Ventures.

Funding History

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SeedSeed RoundSep 2018
$940K

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Series A through Seed — per-round amounts, valuations, and who invested in each round.

Investors

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