Kandou Bus

Kandou AI

Lausanne, Switzerland · Founded 2011 · $254.6M raised

Headquarters
Lausanne
Employees
51–200
Founded
2011
Business Model
B2B
Website
kandou.com
Total Funding
$254.6M
Last Round
$72.3M Series EAug 2023
Rounds
5

About

Kandou Bus (now Kandou AI) is a fabless semiconductor company spun out of EPFL in 2011, specializing in high-speed, energy-efficient chip-to-chip interconnect and SerDes technologies. Its patented Chord Signaling and Copper MIMO innovations enable faster data transmission with lower power and smaller physical footprint than competing solutions. In 2025, the company pivoted to AI hardware infrastructure, offering chiplet-based fabric solutions for AI inference, training clusters, and CXL memory platforms.

Summary

Kandou Bus is a Hardware company based in Lausanne, Switzerland, founded in 2011. It has raised $254.6M in total across 5 rounds, most recently a $72.3M Series E round in Aug 2023. Investors include Climb Ventures, Swiss Select Opportunities / Flexstone Partners and Walden International.

Tech & App Stack

4 technologies & apps tracked

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Funding History

Series ESeries EAug 2023
$72.3M

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Investors

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