Kandou Bus

Kandou Bus (now Kandou AI) is a fabless semiconductor company spun out of EPFL in 2011, specializing in high-speed, energy-efficient chip-to-chip interconnect and SerDes technologies. Its patented Chord Signaling and Copper MIMO innovations enable faster data transmission with lower power and smaller physical footprint than competing solutions. In 2025, the company pivoted to AI hardware infrastructure, offering chiplet-based fabric solutions for AI inference, training clusters, and CXL memory platforms.