Kandou
Kandou AI
Lausanne, Switzerland · Founded 2011 · $478.3M raised
- Headquarters
- Lausanne
- Employees
- 51–200
- Founded
- 2011
- Business Model
- B2B
- Total Funding
- $478.3M
- Last Round
- $225.0M Series AMar 2026
- Rounds
- 6
About
Kandou AI (formerly Kandou Bus) is a fabless semiconductor company founded in 2011 as an EPFL spin-off, headquartered in Lausanne, Switzerland. The company designs high-speed, energy-efficient chip-to-chip interconnect solutions based on its proprietary Copper MIMO technology. Kandou's innovations — including Chord signaling adopted into JEDEC and OIF industry specifications — enable smaller, more energy-efficient chip links. In 2025 the company rebranded as Kandou AI, extending its technology into GPU connectivity, memory connectivity, and network connectivity to democratize AI infrastructure.
Summary
Kandou is a Developer Tools company based in Lausanne, Switzerland, founded in 2011. It has raised $478.3M in total across 6 rounds, most recently a $225.0M Series A round in Mar 2026. Investors include Maverick Silicon, SoftBank and Synopsys.
Tech & App Stack
4 technologies & apps tracked
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Funding History
Mar 2026
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Investors
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