Halo Industries

Halo Industries has invented a breakthrough laser-based technology to replace the decades-old wire saw slicing process used in semiconductor material manufacturing. The company's laser system eliminates kerf loss, dramatically reducing material waste that costs the industry billions of dollars annually. Halo's light-based manufacturing solution enables thinner wafer cuts with higher precision and yield, making it a pioneer in next-generation semiconductor material processing. The company is headquartered in Santa Clara, California, and is actively hiring across engineering and operations roles.