Fusionap

FusionAP is a Malaysia-based advanced semiconductor-packaging company developing scalable 2.5D, 3D, and beyond-Moore solutions using chiplet architectures, advanced interconnects, and system-level optimization. It works with fabless companies, design houses, foundries, and technology suppliers to coordinate design, packaging, and testing from prototype through production. Its services include substrate design and simulation, wafer bumping, heterogeneous integration, rapid prototyping, assembly, and testing.