FLC

FLC (에프엘씨) is a South Korean semiconductor post-process equipment maker spun off from SK Hynix's internal venture program. It develops high-precision Die Bonders for semiconductor packaging, achieving sub-5um bonding accuracy and pioneering an ECT-based die-crack inspection module. The company also automates collet and ejector replacement to boost equipment uptime, aiming to localize and fully automate die-bonding equipment historically dominated by foreign suppliers. FLC has been selected for the government's TIPS program and the KB Unicorn Club, and is expanding into next-generation HBM and advanced packaging markets.