- Headquarters
- San Francisco, California
- Founded
- 2019
- Business Model
- B2B
- Website
- bond.tech
- Total Funding
- $42.0M
- Last Round
- $10.0M SeedJul 2020
- Rounds
- 2
- Acquisition Date
- Jun 2023
About
Bond was an enterprise-grade embedded finance platform that enabled digital brands and non-bank companies to build, launch, and operate their own financial products through a unified set of modern APIs and SDKs. The platform handled the full stack of banking-as-a-service infrastructure — from KYC and account opening to card issuance and money movement — eliminating the need for brands to obtain banking licenses or contract separately with multiple vendors. Bond also provided program management expertise and compliance support. Co-founded by Roy Andrew Ng and Yan Wu in 2019, Bond raised $42 million before being acquired by FIS in 2023.
Summary
Bond is a Fintech company based in San Francisco, United States, founded in 2019. It has raised $42.0M in total across 2 rounds, most recently a $10.0M Seed round in Jul 2020. Investors include Precursor Ventures and Coatue Management.
Tech & App Stack
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Funding History
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Jun 2023
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Seed through Acquisition — per-round amounts, valuations, and who invested in each round.
Investors
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